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Remove individual layers of mold compound down through the lead frames to the substrate.

100% controllable by the operator through our Graphic User Interface.

Full, Localized，or Bevel Decapsulation can be achieved.

Reduces the amount of chemical processing necessary.

Application Examples

Package Pre-opening: plastic, ceramic and MEMS

Pre-cavitation of power devices

Circuitry can often be revealed without acid

Complex-shaped cavities can be made

Exposure of components without destruction of Al, Cu, Au bond wires

For applications requiring subsequent acid cleanup,low temperature, low corrosion conditions can be used.

Glob top removal (Wlip chipped or wired dies on PCB or Ceramic)

Cross section preparation

Bonding cut

Thin PCB cut

Product Specification

Laser type	Fiber laser
Wavelength	1064nm
Max Energy	lmJ/pulse
Max Power	20W
Output Power Range	10-100%
Freq Range	1.6 kHz to 1 MHz
Scan Speed Range	up to 2.5m/s
Focus Mode	Laser AF